Electronic Component Connector Molding Polyamide Hot Melt Resin

Electronic Component Connector Molding Polyamide Hot Melt Resin


Polyamide Hot Melt Resin For Electronic Component and Connector Low Pressure Molding
For Electronic Component and Connector Manufacturing
Medium Open Time, High Heat Resistance
For Medium, High Speed Low Pressure Injection Molding Machine
Application Temperature: 190~210℃
20KGs / 25KGs per Woven Bag
18 Metric Tons per 20’GP Container
Supply Ability: 200 Metric Tons Per Month
MOQ: 20 KGs By Courier, 200 KGs By Sea
Delivery on Time
Free Sample

Description

Item No. PA819
Base Material Polyamide (PA)
Color Translucence Amber
Softening Point 170±5℃
Viscosity 5000±500mPa·s at 200℃
Open Time 20~30 Seconds at 25℃
Application Temperature 190~210℃
Size Pellets
Application For Electronic Component and Connector Manufacturing
For Medium, High Speed Low Pressure Injection Molding Machine
Packaging 20KGs (44LBs) / 25KGs (55LBs) per Woven Bag
Without Pallets 18 Metric Tons per 20’GP Container
With Pallets 10 Metric Tons per 20’GP Container
Loaded on Wooden or Plastic Pallets Stretched and Covered with PE Film
Or According to Your Request
Supply Ability 200 Metric Tons Per Month
Shelf Life 24 Months
Storage Please do not expose it to sunlight.
Please keep cool and dry (not over 45℃).
Please store away from any solvents or chemicals.
Safety and Health Solid and no danger for handing at room temperature.
Please wear safety glasses, gloves, long sleeved shirts during operation.

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